MIL8000 Wafer Inspection System and Microscope Loader
Product EnquiryMIL8000 wafer autoloader and macro inspection station represent the most effective system to automatically load wafers on a microscope and to perform a wafer front and backside macro inspection. It is a compact unit, which makes it possible to load wafers on a microscope and perform Macro Front and Back inspections.
Features:
- Safe and reliable handling of thin wafers with high bow and warpage
- Safety features for operator and process error protection
- Carbon fiber end effectors for scratch-free handling
- Simplified cassette profile definition with auto recipe tool
- Automatic adaptation to different wafer thicknesses based on laser mapping sensor measurements
- Multiple wafer selection methods for productivity and ease of use
- Optimized control software for reduced cycle times
- Programmable inspection types at carrier or wafer level (macro front-side, macro backside, micro)
- Powerful computer control with a user-friendly touchscreen interface
- Easy recipe management for handling configuration switching
- One-click operation for streamlined workflow initiation
Specifications:
| Wafer Size | • 4ʺ, 5ʺ, 6ʺ, 8ʺ • Handles two wafer sizes on the same machine |
| Carrier Detection | • Sensor on indexer platform |
| Ergonomic Carrier Placement | • H-Bar carrier mounting |
| Cassette Mapping | • Emitter-Receiver laser with wafer position measurement |
| Safety Features | • Wafer protrusion detection • Cross-slot detection • Critical distance between wafers |
| Wafer Handling | • Programmable movement speed; carbon fiber end effector, micro holes check for macro and micro inspection |
| Wafer Thickness | • Standard wafers from 200μm to 1000μm |
| Wafer Bow / Warpage | • Up to 2mm (depending on wafer characteristics) |
| Centering | • Optical, with no contact measurement of wafer position; overall precision<0.5mm |
| Alignment | • Optical, on the micro chuck, with high compliance sensor; overall precision <2° |
| Throughput | • > 100 wafers per hour (full thickness wafers, with critical speed reduced to ensure wafer safety) |
| MACRO FRONT Inspection | • 45° motorized flip and rotation joystick adjustable and with programmable rotation speeds |
| MACRO BACK Inspection | • Bernoulli contactless unit with wafer presence detection; programmable air flow for optimal handling, joystick adjustable inclination |
| Illuminators for Macro Inspection | • 2 LED pure green light sources with adjustable intensity |
| Microscope Interface | • Microscope stage position the sensor and stage lock |
| Microscope Chuck | • Wide area chuck for optimal wafer support, motorized rotation and automatic zero return before wafer loading and unloading |
| Cleanliness | • Front side particle contamination: < 0.1 particles cm²; (0.3μm) • Backside particle contamination: < 60 particles cm²; • Front side scratches: 0 defects added; • Edge damages: 0 defects added; • Metal contamination: < 210 atoms/ cm² |
| Operator Interface | • Touch screen and graphic intuitive interface |
| Control System | • PC based, with recipe management for optimal wafer handling |
| Type of Wafer Selection | • Programmable, with inspection recipe management and a direct graphical interface |
| Inspection Type | • MACRO FRONT, MACRO BACK, and MICROSCOPE, programmable for every single wafer in a carrier |
