FINETECH FINEPLACER lambda ma Micro Assembly system
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FineTech FINEPLACER Lambda Micro Assembly System
Sub-Micron Bonding Platform
• Placement accuracy up to 0.5 μm
• Component from 0.07 mm - 60 mm
• Supported substrate size up to 6”
• Closed loop force control
• Very small footprint
• Compact and modular design
• High quality optics
Micro Assembly Processes
• Thermocompression
• Thermosonic
• Ultrasonic
• Soldering (In, AuSn, C4, eutectic)
• Adhesive technologies (ACP, Curing)
• Mechanical assembly
• Curing (UV, thermal)
• Single Laser / Laser bar bonding
• VCSEL, photo diode assembly
• LED bonding
Sub-Micron Bonding Platform
• Placement accuracy up to 0.5 μm
• Component from 0.07 mm - 60 mm
• Supported substrate size up to 6”
• Closed loop force control
• Very small footprint
• Compact and modular design
• High quality optics
Micro Assembly Processes
• Thermocompression
• Thermosonic
• Ultrasonic
• Soldering (In, AuSn, C4, eutectic)
• Adhesive technologies (ACP, Curing)
• Mechanical assembly
• Curing (UV, thermal)
• Single Laser / Laser bar bonding
• VCSEL, photo diode assembly
• LED bonding
