FINETECH FINEPLACER femto Micro Assembly system
製品のお問い合わせFineTech FINEPLACER femto Automated Sub-micron Bonder
• Placement accuracy 0.5 μm
• Component sizes up to 100²mm²
• Working area up to 450 x 150mm²
• Supports wafer up to 12”
• Bonding forces up to 500 N
• Small footprint and compact design
