FINETECH FINEPLACER core Advanced Rework System
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Industry leading cost effective rework
Advanced Rework Applications
Advanced Rework Applications
• BGA, μBGA, CSP, QFN, PoP, QFP, PGA,
• Small Passives (0201, 01005)
• RF shields, RF frames
• Connectors, sockets
• C4 Flip Chip
• Reworkable Underfill, conformal coating
• Single Ball Rework
• Automated soldering processes
• Compact and robust design
• Vision alignment system with Fixed beam splitter
• Intelligent thermal management
• Real time process observation camera
• Reproducible placement accuracy
• Coordinated control of all process parameters: temperature, flow, time, process environment
• Fast process development
