製品

UV/Ozone cleaning system is a tool designed for cleaning and curing of any kind of surface, and in v. Wafers can also be cured by UV-Ozone to remove resist residues or to enhance oxide thickness in epitaxy. UV/Ozone system is based on high frequency UV lamps and features a controlled irradiation.

• Ozone and UV/C irradiation for surface oxidation and curing/decontamination
• Suitable for preparing surfaces for wire bonding, COB processes, and removing resist residues
• Alternative to plasma etching, no need for special vacuum chamber or gases
• Can be integrated into continuous loading cleaning lines with DI water rinse system
• Bench-top version with high-pressure, high-frequency UV tubes and motorized platform
• Safety sensors to prevent ozone contamination and UV exposure to the operator
• User-friendly control interface, no special operator training required
• Available with different wavelength lamps for UV dicing tape curing
• Requires exhaust with minimum 250 m3/h air extraction to remove ozone from the tool and prevent environmental release