製品 > SIL12000 Wafer Loader / MIL 12000 Wafer Inspection System

SIL12000 is an automatic loading system for silicon wafers from FOUP carriers, to be used on Leica DM12000 or other inspection microscopes. MIL12000, with the same loading mechanism, includes MACRO inspection with a collimated light source to complete the inspection options

Features:

Unique FOUP loading system for cost-effective and fast wafer loading
Mechanical structure with linear motion and rotation for safe handling
The architecture ensures safe and fast operation with high process cleanliness
PC system with a user-friendly touchscreen interface
Software with recipe management for easy switching between wafer sizes and thicknesses
Various wafer selection methods for versatile inspection needs
Compatible with SEMI standard FOUP carriers, with automatic carrier opening
Ability to handle manually opened FOSB carriers and 200 mm carriers with an adapter kit
Auto recipe tool for defining new cassette profiles
Default safety features: laser mapping, cross-slot detection, wafer protrusion
Optional microscope rotating chuck with notch finder
The SIL version includes optical centering, an alignment system, and a macro inspection unit for front inspection
MIL version can be interfaced with the RWMAP system for complete defect review and wafer map management
Optional mini environment hood with laminar flow and filtering unit for sensitive applications

Specifications:

Wafer Thickness	• 12” from 600μm - 1000 μm (Standard) • 8” from 200 μm - 1000 μm • Other thickness on request	Throughput	• Up to 100 Wafers per Hour
Wafer Size	• 8”, 12” • Double wafer size version with a 200mm adapter kit	Environment	• Class ISO4 (ISO EN14644) • CE Mark • SEMI Standard Compliant
Wafer Types	• Silicon (Si) • Sapphire (Al2O3) • Glass • Ceramic	Safety Features	• Cross-slot Detection • Laser Mapping with Wafer Thickness and Distance Measurement • Wafer Protrusion Alarm • Faults Detection (Electrical, Vacuum, Air)
User Interface	• Windows 7 • 8” TFT Touch Screen	Networking	• SMB (Windows Networking) • SECS-GEM (Option)
Communication Ports	• Ethernet • USB	Footprint	• 1800 (W) x 1200 (D) x 1350 (H) mm
Handling	• High-reliability Carbon Fiber End Effector • Mechanical wafer recentering • Cassette laser mapping	Options	• Optical centering unit • Rotating microscope chuck with notch finder • MACRO Inspection of the unit with LED light source • 200mm carrier handling kit • Mini environment hood
Inspection Modes	• All Wafers • Selected from a recipe • Direct selection • Statistical Mode	Carrier Type	• 300mm SEMI Standard FOUP carriers • 200mm SEMI Standard carriers with adapter