Machine Productivity
Flexibility:
- Productivity up to: 11K units per hr
- Bond Area: 320 x 320mm / 750 x 700mm
- Face Up / Face Down within a Machine
- Unique 2 Wafer Input Positions
Accuracy:
- Dual Gantry 12 Bond heads
- Accuracy: +/-5um@3Sigma
- JEDEC Tray, Waffle Pack & Tape Feeder
- Large Die Handling up to 75mm
