Wafer Separators

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Features

  • Used for separation of wafers when shipped in a container/ wafer jar
  • Acts as a protective layer in between wafers during transportation
  • Tyvek material is used for its tear proof and non-particulating properties
  • Extremely low sodium (1 PPM) and sulphur (1 PPM) content
  • Special grade resists triboelectric charging is also available

Specifications

Product Code Specifications Packing
DYC950-WH-TC-4 4" 100 pcs/ 20 bags/ ctn
DYC950-WH-TC-5 5" 100 pcs/ 20 bags/ ctn
DYC950-WH-TC-6 6" 100 pcs/ 20 bags/ ctn
DYC950-WH-TC-8 8" 100 pcs/ 20 bags/ ctn
DYC950-WH-TC-12 12" 100 pcs/ 20 bags/ ctn