EFEM 300mm advanced substrates & EFEM 450mm advanced substrates
製品のお問い合わせIt allows automated loading of 300mm/450mm wafers into metrology and process chucks.
Features:
- Compatible with main software controllers on the market
- Compatible with standard silicon wafers, 3DIC (TSV / glass / stacks) & FO-WLP (mold compound / warped wafers)
- Dual end effectors & dual aligners capability for fast wafer swap
- Backside advanced Contact Technology
- Front side and backside wafer ID readers
- ISO Class 1 mini-environment
- Leading edge cleanliness performance (particle / ion-metal / AMC)
- SEMI standards compliant
- 2 or 3 Load Ports configuration
- Compatible with all SEMI compliant FOUP / MAC / FOSB types
