Products > SUE: UV Wafer Eraser or Curing / Cleaning System for 8” wafers with Automatic Loading

The system bed here is a tool intended to expose silicon wafers to UV radiation, with different possible applications depending on the type of UV lamps used

Features:

UV radiation is used for erasing memories, curing chemicals, special dicing or grinding tape deactivation, and UVO cleaning
UV unit integrated into the SIL8000 wafer loader system
Designed for 8" wafers
Utilizes 12 low-pressure UV tubes with electronic ballasts
Uniform irradiation is achieved with a rotating chuck and adjustable chuck level
Requires exhaust with at least 250 m3/h air extraction to remove ozone
Transfers wafers one at a time under the UV source for programmed exposure time
SUE control based on a PC system with a user-friendly touchscreen interface
Recipe management for easy switching between different wafer thicknesses
Different wavelength lamp options are available, such as 380 nm, for UV dicing tape curing
One-click operation to start the system

Specifications:

Wafer Size	• From 100mm to 200mm (two adjacent sizes at a time on request)
Carrier Detection	• Sensor on indexer platform
Ergonomic Carrier Placement	• H-Bar carrier mounting
Cassette Mapping	• Emitter-Receiver laser with wafer position measurement • Wafers detection from a minimum thickness of 180μm to 700μm
Safety Features	• Wafer protrusion detection • Cross-slot detection • Critical distance between wafers • LASER mapping with wafer thickness and distance measurement • Full faults detection and logging (electrical, vacuum, air) • Shutter for UV irradiation insulation
Wafer Handling	• Programmable movement speed • High-reliability carbon fiber end effector • High-precision cassette laser mapping
Wafer Thickness	• Standard wafers from 400μm to 600μm • Other thickness on request
Wafer Bow / Warpage	• < 0.1mm
Centering	• Mechanical pre-centering
Exposure Chuck	• Continuous rotation, programmable speed
Operator Interface	• 10.4” Touch screen and graphic intuitive interface • Windows 7 based
Control System	• PC based, with recipe management for optimal wafer handling and erasure
Networking	• SMB (Windows networking)
Communications Ports	• Ethernet • USB
Environment	• Class ISO4 cleanroom (ISO EN14644) compliant • CE Mark • SEMI standard compliant
Footprint	• 430 (W) x 800 (D) mm